영어 발화 + 경험-직무 연결 간결하게 푸는 결
I applied because I wanted to work in an environment where materials research directly connects to product outcomes. During my internship, I worked on thin-film process optimization and saw how small changes in deposition conditions could shift device performance significantly. That experience made me want to deepen my understanding in a company where semiconductor packaging research is at the core of the business. I believe my background in materials characterization and my interest in process reliability make me a good fit for this role.